RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER PRINTED WIRING BOARD

Title:

RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER PRINTED WIRING BOARD

Document Type and Number:

WIPO Patent Application WO/2016/175326

Kind Code:

A1

Abstract:

Provided are: a resin composition which exhibits particularly good compatibility, while having good dielectric characteristics (low dielectric constant and low dielectric loss tangent) in a high frequency band, high adhesiveness to a conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy; a prepreg using this resin composition; a laminate; and a multilayer printed wiring board. The resin composition specifically contains: (A) a polyphenylene ether derivative that has an N-substituted maleimide structure-containing group and a structural unit represented by general formula (I) in each molecule; (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds; and (C) a styrene-based thermoplastic elastomer. (In the formula, each R1 independently represents an aliphatic hydrocarbon group having 1-5 carbon atoms, or a halogen atom; and x represents an integer of 0-4.)

Inventors:

NAGAI YUKI (JP)
MIZUNO YASUYUKI (JP)
FUKUDA TOMIO (JP)
TANIGAWA TAKAO (JP)
MURAI HIKARI (JP)

Application Number:

PCT/JP2016/063498

Publication Date:

November 03, 2016

Filing Date:

April 28, 2016

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD (JP)

International Classes:

C08L71/12; B32B27/00; C08G65/333; C08J5/24; C08K3/00; C08K5/3415; C08L25/08; C08L53/02; C08L63/00; C08L79/00; C08L79/04

Foreign References:

JP2010018791A	2010-01-28
JP2011225639A	2011-11-10
JP2016079354A	2016-05-16
JP2007099803A	2007-04-19
JP2014034668A	2014-02-24

Other References: