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Title:
RESIN COMPOSITION, AND PREPREG AND LAMINATE USING SAME
Document Type and Number:
WIPO Patent Application WO/2012/057171
Kind Code:
A1
Abstract:
The present invention provides a resin composition with a high Tg (high heat resistance), low thermal expansion, and excellent flame retardation, that is useful for promoting halogen-free resin compositions, and has excellent adhesion to Cu. Also provided are a prepreg obtained by impregnating a base material with the resin composition, and a complex and a laminate obtained from same.　Specifically provided are a modified polyimide resin composition, containing: (A) a polymaleimide compound in a formula (1); (B) an epoxy resin with at least two glycidyl groups per molecule in a formula (2); and (C) a phenol compound with at least two OH groups per molecule. Also specifically disclosed are: a prepreg obtained by impregnating the base material with the modified polyimide resin composition; and a complex and a laminate obtained from the prepreg.

Inventors:
NIIYAMA TETSURO (JP)
SONE YOSHIHISA (JP)
Application Number:
PCT/JP2011/074598
Publication Date:
May 03, 2012
Filing Date:
October 19, 2011
Export Citation:
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Assignee:
AIR WATER INC (JP)
NIIYAMA TETSURO (JP)
SONE YOSHIHISA (JP)
International Classes:
C08L63/00; B32B15/088; C08G59/20; C08G59/40; C08J5/24; C08K5/16
Domestic Patent References:
WO2011126070A12011-10-13
Foreign References:
JP2010090238A2010-04-22
JP2010053334A2010-03-11
JPH093167A1997-01-07
JP2011219674A2011-11-04
JP2010275497A2010-12-09
JPH1045876A1998-02-17
JP2009035728A2009-02-19
JP2002308964A2002-10-23
JP2001247640A2001-09-11
JPH09328601A1997-12-22
JP2011157509A2011-08-18
Attorney, Agent or Firm:
NAKAJIMA, Shigemitsu (JP)
Shigemitsu Nakajima (JP)
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