Title:
RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/090351
Kind Code:
A1
Abstract:
Provided is a resin composition that contains: (A) at least one type selected from the group consisting of maleimide resins having one or more N-substituted maleimide groups and derivatives of said maleimide resins, (B) a poly(phenylene ether) resin having a functional group that includes an ethylenically unsaturated bond, (C) a styrene-based elastomer having a weight average molecular weight (Mw) of more than 10,000 and less than 100,000, and (D) an organic peroxide. Also provided are a prepreg, a laminated board, a resin film, a printed wiring board and a semiconductor package that are obtained using said resin composition.
Inventors:
SHIMOKAWA RYO (JP)
FUJII TOSHIKI (JP)
YANAGIDA MAKOTO (JP)
HIDAKA YOSHIKI (JP)
NAKAMURA YUKIO (JP)
FUJII TOSHIKI (JP)
YANAGIDA MAKOTO (JP)
HIDAKA YOSHIKI (JP)
NAKAMURA YUKIO (JP)
Application Number:
PCT/JP2022/042516
Publication Date:
May 25, 2023
Filing Date:
November 16, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C08L79/00; C08F299/00; C08J5/24; H05K1/03
Domestic Patent References:
| WO2020095422A1 | 2020-05-14 |
Foreign References:
| JP2021138849A | 2021-09-16 | |||
| JP2020169276A | 2020-10-15 | |||
| JP2021176926A | 2021-11-11 | |||
| JPH02120351A | 1990-05-08 | |||
| JP2020169273A | 2020-10-15 | |||
| JP2018168347A | 2018-11-01 | |||
| JP2021147486A | 2021-09-27 | |||
| JP2021080459A | 2021-05-27 | |||
| US20180037736A1 | 2018-02-08 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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