Title:
RESIN COMPOSITION, PREPREG, LAMINATED PLATE, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2021/006163
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin composition which exhibits a stress relaxation effect by lowering an elastic modulus and has more favorable adhesion to a copper foil while maintaining the heat resistance of a resin. A resin composition according to the present invention comprises a radical polymerizable group-containing resin (A), a thermoplastic resin (B) and a radical polymerization initiator (C), wherein: the radical polymerizable group-containing resin (A) includes a vinyl ester resin, an unsaturated polyester resin, or a polyphenylene ether resin having a radical polymerizable group; the thermoplastic resin (B) includes at least one selected from the group consisting of a polyester polyol and a polyurethane polyol; and a cured product thereof forms a phase separation structure.
Inventors:
MATSUMURA YUUSUKE (JP)
NAKAMURA AKIFUMI (JP)
NAKAMURA AKIFUMI (JP)
Application Number:
PCT/JP2020/025945
Publication Date:
January 14, 2021
Filing Date:
July 02, 2020
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08F299/02; C08J5/24; H05K1/03
Domestic Patent References:
| WO2019044803A1 | 2019-03-07 | |||
| WO2019131413A1 | 2019-07-04 |
Foreign References:
| JP2009299011A | 2009-12-24 | |||
| JP2001261758A | 2001-09-26 | |||
| JP2006049374A | 2006-02-16 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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