Title:
RESIN COMPOSITION, PREPREG, LAMINATED PLATE, RESIN FILM, PRINT WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/145377
Kind Code:
A1
Abstract:
The present invention pertains to: a resin composition containing (A) at least one that is selected from the group consisting of maleimide compounds having two or more N-substituted maleimide groups and derivatives thereof, and that includes a fused ring of an aromatic ring and an aliphatic ring in the molecular structure thereof, and (B) a resin having a tensile elastic modulus of 10 GPa or less at 25°C; and a prepreg, a laminated plate, a resin film, a print wiring board, and a semiconductor package, in all of which said resin composition is used.
Inventors:
IWANAGA KOHTA (JP)
KOTAKE TOMOHIKO (JP)
TSUKAHARA TOMOAKI (JP)
SUZUKI TAKAYUKI (JP)
NAKAMURA SHOTA (JP)
KOTAKE TOMOHIKO (JP)
TSUKAHARA TOMOAKI (JP)
SUZUKI TAKAYUKI (JP)
NAKAMURA SHOTA (JP)
Application Number:
PCT/JP2021/048276
Publication Date:
July 07, 2022
Filing Date:
December 24, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08K5/3415; B32B7/022; B32B15/08; B32B15/088; C08J5/24; C08L15/00; C08L101/12; H05K1/03; H05K3/46
Domestic Patent References:
| WO2020217678A1 | 2020-10-29 | |||
| WO2020217672A1 | 2020-10-29 | |||
| WO2020217675A1 | 2020-10-29 | |||
| WO2020217676A1 | 2020-10-29 | |||
| WO2020095422A1 | 2020-05-14 | |||
| WO2019230943A1 | 2019-12-05 |
Foreign References:
| JPH06192478A | 1994-07-12 | |||
| JP2021161325A | 2021-10-11 | |||
| JP2021161323A | 2021-10-11 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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