Title:
RESIN COMPOSITION, PREPREG, LAMINATED PLATE, METAL-CLAD LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/074886
Kind Code:
A1
Abstract:
Provided is a resin composition that has low thermal expansion properties and exhibits high strength of adhesion with a metal foil and high solder heat resistance. Also provided are a prepreg, a laminated plate, a metal-clad laminated plate, a printed wiring board, and a semiconductor package that are produced using the resin composition. Specifically, the resin composition contains (A) an acrylic polymer and (B) a thermosetting resin, said resin composition further including (C) at least one compound selected from the group consisting of (C1) phosphate ester compounds, (C2) phosphazene compounds, and (C3) phosphaphenanthrene compounds.
Inventors:
SAKAMOTO NORIHIKO (JP)
SUDO KYOSUKE (JP)
KITAJIMA TAKAYO (JP)
SHIMAOKA SHINJI (JP)
SUDO KYOSUKE (JP)
KITAJIMA TAKAYO (JP)
SHIMAOKA SHINJI (JP)
Application Number:
PCT/JP2022/040575
Publication Date:
May 04, 2023
Filing Date:
October 31, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C08L33/04; C08J5/24; C08K5/3415; C08K5/521; C08K5/527; C08K5/5399; C08L101/00; H05K1/03
Domestic Patent References:
| WO2018181516A1 | 2018-10-04 |
Foreign References:
| JP2019123769A | 2019-07-25 | |||
| JP2006274150A | 2006-10-12 | |||
| JP2001013679A | 2001-01-19 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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