Title:
RESIN COMPOSITION, PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2024/085028
Kind Code:
A1
Abstract:
The present invention relates to a resin composition that contains: (A) at least one selected from the group consisting of a maleimide resin having at least one N-substituted maleimide group and a derivative of said maleimide resin; and (B) a phosphate ester compound which has at least two phosphorus atoms, and includes an aromatic ring in which the number of groups that connect the at least two phosphorus atoms is at least two. The present invention also relates to a prepreg, a laminated plate, a printed wiring board, and a semiconductor package which use said resin composition.
Inventors:
MATSUOKA SHIORI (JP)
NAKAMURA YUKIO (JP)
YANAGIDA MAKOTO (JP)
UENO FUMITAKA (JP)
NAKAMURA YUKIO (JP)
YANAGIDA MAKOTO (JP)
UENO FUMITAKA (JP)
Application Number:
PCT/JP2023/036836
Publication Date:
April 25, 2024
Filing Date:
October 11, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C08F299/00; B32B15/08; C08J5/24
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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