RESIN COMPOSITION, PREPREG, LAMINATED SHEET AND SEMICONDUCTOR PACKAGE

Title:

RESIN COMPOSITION, PREPREG, LAMINATED SHEET AND SEMICONDUCTOR PACKAGE

Document Type and Number:

WIPO Patent Application WO/2003/018675

Kind Code:

A1

Abstract:

A resin composition for use in forming a prepreg (1) in a sheet form through impregnating a base material with it, which comprises a first thermosetting resin, a second thermosetting resin having a weight average molecular weight lower than that of the first thermosetting resin, a curing agent and a filler&semi a prepreg (1) comprising a base material (11) impregnated with the above resin composition&semi a printed wiring board which is formed through laminating a metal foil (22) on the prepreg, followed by heating and pressing&semi and a semiconductor package (3) which comprises a prepreg (31) having a metal foil (34) laminated thereon and an IC chip (33) mounted on the prepreg. The resin composition can impart to a prepreg comprising the composition sufficient flexibility to prevent cracking. The prepreg has sufficient flexibility to prevent cracking and also is almost free from the surface tackiness even in an uncured state, resulting in good workability during the transportation thereof.

Inventors:

HOSOMI TAKESHI (JP)
YAMASHITA MASAKO (JP)
BABA TAKAYUKI (JP)
YABUKI KENTARO (JP)

Application Number:

PCT/JP2002/008845

Publication Date:

March 06, 2003

Filing Date:

August 30, 2002

Export Citation:

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Assignee:

SUMITOMO BAKELITE CO (JP)
HOSOMI TAKESHI (JP)
YAMASHITA MASAKO (JP)
BABA TAKAYUKI (JP)
YABUKI KENTARO (JP)

International Classes:

C08J5/24; H05K1/03; (IPC1-7): C08J5/24

Foreign References:

JP2001156461A	2001-06-08
JPH0952941A	1997-02-25
JPH09136943A	1997-05-27
JPS61209234A	1986-09-17
JP2000344862A	2000-12-12
JPS62169828A	1987-07-27
JPH11181123A	1999-07-06
JP2001081305A	2001-03-27
JPH01245038A	1989-09-29
JPH11158752A	1999-06-15
JP2002172736A	2002-06-18
JP2002309085A	2002-10-23

Other References: