Title:
RESIN COMPOSITION, AND PREPREG AND LAMINATED SHEET USING SAME
Document Type and Number:
WIPO Patent Application WO/2011/152402
Kind Code:
A1
Abstract:
Provided is a resin composition which exhibits excellent heat resistance, thermal conductivity, and water absorbency. The resin composition comprises (A) a cyanate resin represented by formula (I), (B) an epoxy resin, and (C) an inorganic filler, with the amount of the inorganic filler (C) being 301 to 700 parts by mass per 100 parts by mass of the total sum of the resins (A) and (B). In formula (I), Rs are each independently a hydrogen atom or methyl; and n is an integer of 1 to 50.
Inventors:
SOGAME MASANOBU (JP)
UEYAMA DAISUKE (JP)
OTSUKA HAJIME (JP)
UEYAMA DAISUKE (JP)
OTSUKA HAJIME (JP)
Application Number:
PCT/JP2011/062496
Publication Date:
December 08, 2011
Filing Date:
May 31, 2011
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
SOGAME MASANOBU (JP)
UEYAMA DAISUKE (JP)
OTSUKA HAJIME (JP)
SOGAME MASANOBU (JP)
UEYAMA DAISUKE (JP)
OTSUKA HAJIME (JP)
International Classes:
C08L63/00; B32B15/08; B32B27/38; C08J5/24; C08K3/00; C08K5/3415; C08L65/00; H05K1/03
Foreign References:
| JP2009024056A | 2009-02-05 | |||
| JP2007045984A | 2007-02-22 | |||
| JP2010007040A | 2010-01-14 | |||
| JP2004027177A | 2004-01-29 | |||
| JP2010031263A | 2010-02-12 | |||
| JP2008050526A | 2008-03-06 | |||
| JP2008214602A | 2008-09-18 | |||
| JP2007138075A | 2007-06-07 | |||
| JP2007284596A | 2007-11-01 | |||
| JP2007045984A | 2007-02-22 | |||
| JPH07202364A | 1995-08-04 |
Other References:
See also references of EP 2578631A4
Attorney, Agent or Firm:
KATSUNUMA Hirohito et al. (JP)
Katsunuma Hirohito (JP)
Katsunuma Hirohito (JP)
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Claims: