Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION, PREPREG, METAL-FOIL-CLAD LAMINATED BOARD, RESIN SHEET, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2018/047724
Kind Code:
A1
Abstract:
A resin composition containing an epoxy resin (A) represented by formula (1) and a cyanic acid ester compound (B). (In formula (1), Ar represents a polycyclic aromatic group, R represents a hydrogen atom or methyl group, G represents a glycidyl group, and n represents an integer of 0-15.)

More Like This:
JP2000505498INDUSTRIAL APPLICABILITY: In-situ emulsified reactive epoxy polymer composition.
JPH0391523ADVANCED EPOXY RESIN COMPOSITION AND ITS PRODUCTION
Inventors:
KOGA SHOTA (JP)
UEYAMA DAISUKE (JP)
TAKANO KENTARO (JP)
Application Number:
PCT/JP2017/031512
Publication Date:
March 15, 2018
Filing Date:
September 01, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G59/06; B32B15/08; B32B15/092; C08J5/24; C08L63/00; H05K1/03
Domestic Patent References:
WO2013065694A12013-05-10
WO2014203866A12014-12-24
WO2017038979A12017-03-09
WO2013065694A12013-05-10
WO2014203866A12014-12-24
Foreign References:
JP2012251048A2012-12-20
JP2004331680A2004-11-25
JP2003252953A2003-09-10
JP2003073318A2003-03-12
JPH04328115A1992-11-17
Other References:
See also references of EP 3511355A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: CLAD WELDED PIPE AND METHOD OF MANUFACTURING SAME

Next Patent: DETECTION CIRCUIT AND POWER STORAGE PACK