Title:
RESIN COMPOSITION, PREPREG, METAL FOIL LAMINATED PLATE, RESIN SHEET, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/230942
Kind Code:
A1
Abstract:
Provided is a resin composition whereby a cured material having excellent copper foil adhesion and low dielectric characteristics can be formed. A resin composition including a thermoplastic polymer (A) including any one or more groups from among the group consisting of a nitrile group, an epoxy group, an allyl group, a vinyl group, a carboxy group, an alkoxysilyl group, an acrylic group, a methacrylic group, a phenyl group, and a phenol-based hydroxyl group, a maleimide compound (B), and/or a cyanic acid ester compound (C), the functional group equivalent ratio represented by formula (i) thereof being 0.005-0.2. (i): Functional group equivalent ratio = (a)/((b) + (c)). (In formula (i), (a), (b), and (c) are the functional group equivalent weight (g/eq.) of the thermoplastic polymer (A), the maleimide compound (B), and the cyanic acid ester compound (C), respectively.)
Inventors:
YAMAMOTO KATSUYA (JP)
HONDA SAORI (JP)
HIGASHITA KAZUYUKI (JP)
UENO YOSHITAKA (JP)
HONDA SAORI (JP)
HIGASHITA KAZUYUKI (JP)
UENO YOSHITAKA (JP)
Application Number:
PCT/JP2019/021691
Publication Date:
December 05, 2019
Filing Date:
May 31, 2019
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L101/02; B32B15/08; C08G73/00; C08J5/24; C08K3/013; C08L35/00; C08L79/04; H05K1/03
Domestic Patent References:
| WO2013172435A1 | 2013-11-21 |
Foreign References:
| JP2017206578A | 2017-11-24 | |||
| JPH01158039A | 1989-06-21 | |||
| JP2006028265A | 2006-02-02 | |||
| JP2016147435A | 2016-08-18 | |||
| JP2015180751A | 2015-10-15 | |||
| JPH0839685A | 1996-02-13 | |||
| JP2013207177A | 2013-10-07 | |||
| JP2018059100A | 2018-04-12 | |||
| JP2019052278A | 2019-04-04 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
Download PDF: