Title:
RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATED PLATE, METAL FOIL-CLAD LAMINATED PLATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/190118
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a resin composition that is suitable for use in the production of an insulating layer of a printed wiring board, the resin composition having a high dielectric constant, a low dielectric loss tangent, a high metal foil peel strength, excellent moisture absorption and heat resistance, and excellent thermal properties; and a prepreg, a resin sheet, a laminated plate, a metal foil-clad laminated plate, and a printed wiring board obtained using the resin composition. This resin composition contains a dielectric powder (A), an aromatic phosphorus compound (B), and a thermosetting resin (C).
Inventors:
TAKAMURA TATSURO (JP)
ITO SAYAKA (JP)
YAMAGUCHI SHOHEI (JP)
SAHARA SHUNYA (JP)
KASHIMA NAOKI (JP)
OGASHIWA TAKAAKI (JP)
ITO SAYAKA (JP)
YAMAGUCHI SHOHEI (JP)
SAHARA SHUNYA (JP)
KASHIMA NAOKI (JP)
OGASHIWA TAKAAKI (JP)
Application Number:
PCT/JP2023/011741
Publication Date:
October 05, 2023
Filing Date:
March 24, 2023
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L101/00; B32B15/08; C08J5/24; C08K3/013; C08K3/24; C08K5/49; H05K1/03
Domestic Patent References:
| WO2020031495A1 | 2020-02-13 | |||
| WO2019150994A1 | 2019-08-08 |
Foreign References:
| JP2002212450A | 2002-07-31 | |||
| US20150183987A1 | 2015-07-02 | |||
| JP2019083251A | 2019-05-30 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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