Title:
RESIN COMPOSITION, PREPREG AND RESIN SHEET, AND METAL FOIL-CLAD LAMINATE
Document Type and Number:
WIPO Patent Application WO/2012/128313
Kind Code:
A1
Abstract:
[Problem] To provide a resin composition that is suitable for use in printed circuit boards and that maintains flame resistance, has excellent electrical properties, heat resistance, and peel strength, and to provide a prepreg and resin sheet that use the same, and a metal foil-clad laminate that uses the prepreg. [Solution] A resin composition obtained from a polyphenylene ether (A), a specific phosphorus-containing cyanic acid ester compound (B), a halogen-free epoxy resin (C), a cyanic acid ester compound (D), and a filler (E).
Inventors:
YAGINUMA MICHIO (JP)
ITOH SYOUICHI (JP)
UENO YOSHITAKA (JP)
ITOH SYOUICHI (JP)
UENO YOSHITAKA (JP)
Application Number:
PCT/JP2012/057308
Publication Date:
September 27, 2012
Filing Date:
March 22, 2012
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
YAGINUMA MICHIO (JP)
ITOH SYOUICHI (JP)
UENO YOSHITAKA (JP)
YAGINUMA MICHIO (JP)
ITOH SYOUICHI (JP)
UENO YOSHITAKA (JP)
International Classes:
B32B15/08; C08G59/40; C08J5/24; H05K1/03
Domestic Patent References:
| WO2009041137A1 | 2009-04-02 | |||
| WO2010035452A1 | 2010-04-01 |
Foreign References:
| JP2009073996A | 2009-04-09 | |||
| JP2008088079A | 2008-04-17 | |||
| JP2006193607A | 2006-07-27 | |||
| JPS57145127A | 1982-09-08 | |||
| JP2005105099A | 2005-04-21 | |||
| JP2002194212A | 2002-07-10 | |||
| JPH10273518A | 1998-10-13 | |||
| JP2005120173A | 2005-05-12 | |||
| JPH1135795A | 1999-02-09 | |||
| JP2002194235A | 2002-07-10 | |||
| JPH10292122A | 1998-11-04 | |||
| JP2003221430A | 2003-08-05 |
Other References:
See also references of EP 2690120A4
Attorney, Agent or Firm:
KATSUNUMA Hirohito et al. (JP)
Katsunuma Hirohito (JP)
Katsunuma Hirohito (JP)
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Claims: