Title:
RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2017/006897
Kind Code:
A1
Abstract:
Provided is a resin composition having excellent moldability and which is a raw material for a printed wiring board which has excellent heat resistance after moisture absorption. The resin composition includes: a maleimide compound; a silane compound which has a carbon-carbon unsaturated bond and either a hydrolyzable group or a hydroxyl group; a silane compound which has an epoxy backbone and either a hydrolyzable group or a hydroxyl group; and an inorganic filler.
Inventors:
TOMIZAWA KATSUYA (JP)
TAKANO YOICHI (JP)
ITO MEGURU (JP)
SHIGA EISUKE (JP)
TAKANO YOICHI (JP)
ITO MEGURU (JP)
SHIGA EISUKE (JP)
Application Number:
PCT/JP2016/069754
Publication Date:
January 12, 2017
Filing Date:
July 04, 2016
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L35/00; B32B5/00; B32B15/082; B32B27/00; B32B27/30; C08F2/44; C08J5/24; H05K1/03
Domestic Patent References:
| WO2015060266A1 | 2015-04-30 |
Foreign References:
| JP2011530618A | 2011-12-22 | |||
| JP2006124425A | 2006-05-18 | |||
| JPH10292033A | 1998-11-04 | |||
| JP2014185222A | 2014-10-02 |
Other References:
See also references of EP 3321320A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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