Title:
RESIN COMPOSITION AND PREPREG SHEET USING SAME, AND INSULATING PLATE
Document Type and Number:
WIPO Patent Application WO/2021/134993
Kind Code:
A1
Abstract:
The present invention relates to a resin composition and a prepreg sheet using same, and an insulating plate. The resin composition comprises a combination of a modified maleimide compound and a polymer containing an alkenyl group. The modified maleimide compound is prepared from compound (A) or an organometallic salt of an amino-containing silane, and compound (B) containing at least two maleimido groups. The resin composition provided by the present invention has a higher bonding strength, and can be used to prepare a laminate with a high peel strength, a low dielectric constant, a high heat resistance and a high flame retardancy, and the modified maleimide compound has a good compatibility with a resin and will not crystallize easily during processing.
Inventors:
MENG YUNDONG (CN)
LUO CHENG (CN)
XU YONGJING (CN)
FANG KEHONG (CN)
LUO CHENG (CN)
XU YONGJING (CN)
FANG KEHONG (CN)
Application Number:
PCT/CN2020/086538
Publication Date:
July 08, 2021
Filing Date:
April 24, 2020
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08G73/10; B32B15/00; B32B27/04; C08L79/08; H05K1/00
Domestic Patent References:
| WO2016151384A1 | 2016-09-29 |
Foreign References:
| CN102775605A | 2012-11-14 | |||
| CN104093779A | 2014-10-08 | |||
| CN108250746A | 2018-07-06 | |||
| CN101775139A | 2010-07-14 | |||
| JP2000204251A | 2000-07-25 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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