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Patent Searching and Data


Title:
RESIN COMPOSITION, AND PREPREG AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/125784
Kind Code:
A1
Abstract:
The present invention relates to a resin composition, and a prepreg and the use thereof. The resin composition comprises the following components, in parts by weight: 50 to 150 parts of a modified epoxy resin, 40 to 120 parts of a modified benzoxazine resin, 20 to 100 parts of a bismaleimide resin, 0.1 to 15 parts of an initiator, and 150 to 550 parts of an inorganic filler, wherein the structural formula of the modified epoxy resin is (1-1), and the modified benzoxazine resin is a modified basic benzoxazine resin having a double-bond structure as a terminal group. In the resin composition, a polybutadiene modified epoxy resin and the bismaleimide resin can form an interpenetrating polymer network; ultimately, a resin composition with a low dielectric constant, low dielectric loss and a low linear expansion coefficient is obtained.

Inventors:
GUO YONGJUN (CN)
XIAO HAO (CN)
QI XIAOLONG (CN)
Application Number:
PCT/CN2022/143316
Publication Date:
July 06, 2023
Filing Date:
December 29, 2022
Export Citation:
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Assignee:
GUANGDONG HINNO TECH CO LTD (CN)
RES INST TSINGHUA PEARL RIVER DELTA (CN)
International Classes:
C08L63/10; B32B15/04; B32B15/20; B32B17/04; B32B17/06; C08K3/36; C08K7/18; C08K9/04; C08L61/34; C08L79/08
Domestic Patent References:
WO2013056426A12013-04-25
Foreign References:
CN114133704A2022-03-04
CN102504532A2012-06-20
CN113121999A2021-07-16
CN103834168A2014-06-04
CN109825081A2019-05-31
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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