Title:
RESIN COMPOSITION, PREPREG USING SAME, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED BOARD, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/059562
Kind Code:
A1
Abstract:
An aspect of the present invention relates to a resin composition characterized by including: a polyphenylene ether compound having a group represented by formula (1) at the end of the molecule; and at least one from among a crosslinking agent having a carbon-carbon unsaturated double bond in the molecule or a crosslinking agent that reacts with the polyphenylene ether compound and performs curing, wherein the amount of chloride ions in the polyphenylene ether compound is 250 ppm or less. [In formula (1), R1 represents a hydrogen atom or an alkyl group having 1-10 carbon atoms, and R2 represents an alkylene group having 1-10 carbon atoms.]
Inventors:
INOUE YUKI
ABE TOMOYUKI
ARISAWA TATSUYA
ABE TOMOYUKI
ARISAWA TATSUYA
Application Number:
PCT/JP2019/035392
Publication Date:
March 26, 2020
Filing Date:
September 09, 2019
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08F290/06; B32B15/08; B32B27/00; C08J5/24; H05K1/03
Domestic Patent References:
| WO2018074278A1 | 2018-04-26 | |||
| WO2019208471A1 | 2019-10-31 |
Foreign References:
| JP2014189781A | 2014-10-06 | |||
| JP2009024167A | 2009-02-05 | |||
| JP2009096953A | 2009-05-07 | |||
| JP2016113543A | 2016-06-23 | |||
| JP2017025228A | 2017-02-02 |
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
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