Title:
RESIN COMPOSITION, PREPREG USING SAME, FILM PROVIDED WITH RESIN, METAL FOIL PROVIDED WITH RESIN, METAL-CLAD LAYERED BOARD, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/244725
Kind Code:
A1
Abstract:
One aspect of the present invention relates to a resin composition containing: a maleimide compound (A) having at least one selected from C6 or greater alkyl groups and C6 or greater alkylene groups; and a hydrocarbon compound (B) represented by formula (1). [In formula (1), X is a C6 or greater hydrocarbon group containing at least one selected from aromatic ring groups and aliphatic ring groups. n is an integer between 1 and 10.]
Inventors:
NISHIGUCHI YASUNORI
SAITO HIROSUKE
SAITO HIROSUKE
Application Number:
PCT/JP2022/020362
Publication Date:
November 24, 2022
Filing Date:
May 16, 2022
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08F222/40; B32B15/088; B32B27/34; C08F212/34; C08F220/20; C08J5/24; C08K3/013; C08K5/49; C08L35/00; H05K1/03
Domestic Patent References:
| WO2019188189A1 | 2019-10-03 | |||
| WO2021100658A1 | 2021-05-27 |
Foreign References:
| JP2004271692A | 2004-09-30 | |||
| JP2005179276A | 2005-07-07 | |||
| JP2005154379A | 2005-06-16 |
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
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