RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG, LAMINATE, AND PRINTED WIRING BOARD MADE WITH THE SAME

Title:

RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG, LAMINATE, AND PRINTED WIRING BOARD MADE WITH THE SAME

Document Type and Number:

WIPO Patent Application WO/2005/007724

Kind Code:

A1

Abstract:

An epoxy resin composition for printed wiring boards which comprises an epoxy resin, a phenolic novolak, a curing accelerator, and a silica filler, characterized in that the silica filler has a shape having at least two planes and has an average particle diameter of 0.3 to 10 µm and a specific surface area of 8 to 30 m²/g. The epoxy resin composition has a higher apparent viscosity than the resins and can hence be inhibited from sagging in a drying oven. This composition retains the intact property of infiltrating into reinforcements because the viscosity of the resins themselves has not increased locally. The composition hence produces the effect of improving the appearance of a prepreg.

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Inventors:

MOTOBE HIDETSUGU (JP)
HIBINO AKINORI (JP)
ITO KATSUHIKO (JP)

Application Number:

PCT/JP2004/004723

Publication Date:

January 27, 2005

Filing Date:

March 31, 2004

Export Citation:

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Assignee:

MATSUSHITA ELECTRIC WORKS LTD (JP)
MOTOBE HIDETSUGU (JP)
HIBINO AKINORI (JP)
ITO KATSUHIKO (JP)

International Classes:

C08G59/62; C08L61/06; C08L63/00; H05K1/03; C08K3/36; C08K7/00; (IPC1-7): C08G59/62; H05K1/03

Foreign References:

JP2001102758A	2001-04-13
JPH09136943A	1997-05-27
JP2003020327A	2003-01-24
JP2004149577A	2004-05-27
JP2003128877A	2003-05-08
JPH11269355A	1999-10-05

Other References: