Title:
RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE
Document Type and Number:
WIPO Patent Application WO/2014/132654
Kind Code:
A1
Abstract:
Provided is a resin composition for a printed wiring board which ensures excellent moldability and is capable of forming a substrate material which has a low coefficient of thermal expansion. This resin composition for a printed wiring board comprises a thermosetting resin that includes an epoxy resin, a curing agent, an inorganic filler and an expansion relief component composed of an acrylic resin soluble in an organic solvent. The content of the inorganic filler is 150 parts by mass or more with respect to 100 parts by mass of the sum of the thermosetting resin and the curing agent. The melt viscosity at 130°C is less than 50000 Ps.
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Inventors:
MATSUMOTO MASAAKI
HOSHINO YASUNORI
YONEMOTO TATSUO
HOSHINO YASUNORI
YONEMOTO TATSUO
Application Number:
PCT/JP2014/001069
Publication Date:
September 04, 2014
Filing Date:
February 27, 2014
Export Citation:
Assignee:
PANASONIC CORP (JP)
International Classes:
C08G59/18; C08J5/24; C08K3/36; C08L33/08; C08L61/06; C08L63/00; H05K1/03
Foreign References:
| JP2011162615A | 2011-08-25 | |||
| JP2009253138A | 2009-10-29 | |||
| JP2011253949A | 2011-12-15 |
Attorney, Agent or Firm:
NISHIKAWA, Yoshikiyo et al. (JP)
Yoshikiyo Nishikawa (JP)
Yoshikiyo Nishikawa (JP)
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