Title:
RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG, LAMINATED BOARD, METAL FOIL-CLAD LAMINATED BOARD, PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/031545
Kind Code:
A1
Abstract:
Provided is a resin composition for a printed wiring board, the resin composition containing a phenol compound (A), a maleimide compound (B), an epoxy compound (C), a cyclic carbodiimide compound (D), an inorganic filler (E), and a curing accelerator (F), wherein the content of the inorganic filler (E) is 100-250 parts by mass with respect to 100 parts by mass of a resin solid content.
Inventors:
YAMAGUCHI SHOHEI (JP)
TOMIZAWA KATSUYA (JP)
SHIDA NORIHIRO (JP)
KAWAI HIDETOSHI (JP)
TOMIZAWA KATSUYA (JP)
SHIDA NORIHIRO (JP)
KAWAI HIDETOSHI (JP)
Application Number:
PCT/JP2019/025921
Publication Date:
February 13, 2020
Filing Date:
June 28, 2019
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L63/00; B32B15/08; B32B27/20; B32B27/34; C08G59/40; C08J5/24; C08K3/36; C08L61/06; H05K1/03
Domestic Patent References:
| WO2017168732A1 | 2017-10-05 | |||
| WO2016039486A1 | 2016-03-17 | |||
| WO2010071213A1 | 2010-06-24 |
Foreign References:
| JP2018053092A | 2018-04-05 | |||
| JP2018035308A | 2018-03-08 | |||
| JP2017031402A | 2017-02-09 | |||
| JP2017125150A | 2017-07-20 | |||
| JP2018150563A | 2018-09-27 |
Other References:
See also references of EP 3835358A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Download PDF:
Previous Patent: INFORMATION PROCESSING DEVICE FOR MUSICAL-SCORE DATA
Next Patent: METHOD AND APPARATUS FOR ACCELERATED CORROSION TESTING
Next Patent: METHOD AND APPARATUS FOR ACCELERATED CORROSION TESTING