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Patent Searching and Data


Title:
RESIN COMPOSITION FOR PRINTED WIRING BOARDS AND RESIN SHEET FOR PRINTED WIRING BOARDS USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/209093
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a resin composition for printed wiring boards, which has high flexibility in a B-stage state, and a cured product of which has high dimensional stability with respect to heat. A resin composition for printed wiring boards according to the present invention contains a maleimide compound, a (meth)acrylic resin having a weight average molecular weight of 50,000 or more, a curing accelerator, and an inorganic filler. The maleimide compound is contained in an amount of from 25 parts by mass to 93 parts by mass (inclusive) per 100 parts by mass of the total of the maleimide compound, the (meth)acrylic resin and the curing accelerator. The (meth)acrylic resin is contained in an amount of from 7 parts by mass to 70 parts by mass (inclusive). The inorganic filler is contained in an amount of from 100 parts by mass to 400 parts by mass (inclusive).

Inventors:
HOSOI, Toshihiro (656-2, Futatsumiya, Ageo-sh, Saitama 17, 〒3620017, JP)
MATSUSHIMA, Toshifumi (656-2, Futatsumiya, Ageo-sh, Saitama 17, 〒3620017, JP)
OOSAWA, Kazuhiro (656-2, Futatsumiya, Ageo-sh, Saitama 17, 〒3620017, JP)
FUKUDA, Kenshiro (656-2, Futatsumiya, Ageo-sh, Saitama 17, 〒3620017, JP)
Application Number:
JP2017/020007
Publication Date:
December 07, 2017
Filing Date:
May 30, 2017
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO., LTD. (1-11-1 Osaki, Shinagawa-ku Tokyo, 84, 〒1418584, JP)
International Classes:
C08L33/04; B32B27/30; C08K3/00; C08K5/3415; C08L63/00; H05K1/03
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (NIKKEN AKASAKA BLDG, 7F. 5-7, Akasaka 2-chome, Minato-K, Tokyo 52, 〒1070052, JP)
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