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Title:
RESIN COMPOSITION, PROCESS FOR PRODUCING RESIN COMPOSITION, AND MOLDED OBJECT
Document Type and Number:
WIPO Patent Application WO/2017/208945
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a resin composition and a molded object, the resin composition being excellent in terms of low-temperature impact resistance, chemical resistance, and tracking resistance and having rigidity that renders the resin composition applicable to mechanism components or structures. The resin composition of the present invention is characterized by comprising (a) a poly(phenylene ether) resin and further comprising: (b-1) a hydrogenated block copolymer having a molecular-weight peak at 80,000-200,000 and/or a modification of the copolymer and (b-2) a hydrogenated block copolymer having a molecular-weight peak at 10,000 or higher but lower than 80,000 and/or a modification of the copolymer; and/or (c) an olefin-based polymer obtained from one or more olefins other than propylene. The resin composition is further characterized in that the component (a) forms a continuous phase, the polymer blocks B have a glass transition temperature of -50ºC or lower, the component (c) has an embrittlement temperature of -50ºC or lower, and the resin composition contains substantially no polypropylene resin (g) and has a flexural modulus, as measured in accordance with ISO 178, of 1,600 MPa or greater.

Inventors:
INAGAKI NOZOMI (JP)
OGATA KAZUYUKI (JP)
Application Number:
PCT/JP2017/019438
Publication Date:
December 07, 2017
Filing Date:
May 24, 2017
Export Citation:
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Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
C08L71/12; C08K5/521; C08K5/5313; C08L23/00; C08L53/00
Domestic Patent References:
WO2015108646A12015-07-23
WO2015098770A12015-07-02
WO2008093648A12008-08-07
WO2015050060A12015-04-09
Foreign References:
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Other References:
ANONYMOUS: "TAFMER DF&A Meigara no Kihon Bussei (TAFMER Alpha-olefin copolymer)", 8 December 2015 (2015-12-08), XP009511478, Retrieved from the Internet
ANALYTICAL CHEMISTRY, vol. 21, no. 8, August 1949 (1949-08-01)
See also references of EP 3467034A4
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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