Title:
RESIN COMPOSITION, PRODUCTION METHOD FOR RESIN FILM, AND PRODUCTION METHOD FOR ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/049517
Kind Code:
A1
Abstract:
Provided is a resin composition which comprises (a) at least one resin selected from among polyimides and polyimide precursors and (b) a solvent, characterized by having a loss tangent (tanδ) represented by equation (I) of 150 or greater but less than 550 when examined for dynamic viscoelasticity under the conditions of a temperature of 22°C and a circular frequency of 10 rad/s. Coating films of the resin composition are free from troubles such as film burst during vacuum drying, and give films having satisfactory thickness evenness and mechanical properties.
tanδ = G"/G' (I)
(In equation (I), G' indicates the storage modulus of resin composition and G" indicates the loss modulus of resin composition.)
Inventors:
ASHIBE TOMOKI (JP)
UEOKA KOJI (JP)
UEOKA KOJI (JP)
Application Number:
PCT/JP2018/027032
Publication Date:
March 14, 2019
Filing Date:
July 19, 2018
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08L79/08; C08G73/10; C08J5/18; G06F3/041; G09F9/00; H01L27/32; H01L51/50; H05B33/02; H05B33/10
Domestic Patent References:
| WO2017099183A1 | 2017-06-15 | |||
| WO2013146967A1 | 2013-10-03 |
Foreign References:
| JP2014009305A | 2014-01-20 | |||
| US20130172494A1 | 2013-07-04 |
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