Title:
RESIN COMPOSITION, PROTECTIVE FILM CONTAINING SAME, DRY FILM, CIRCUIT BOARD, AND MULTILAYER CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2012/090476
Kind Code:
A1
Abstract:
One purpose of the present invention is to provide: a resin composition which is capable of forming a film that has excellent heat resistance and slidability/bendability; a protective film for circuits, which uses the resin composition; and a dry film or the like which comprises the protective film. Another purpose of the present invention is to provide a circuit board and a multilayer circuit board, each of which has excellent heat resistance and slidability/bendability.
In order to achieve the above-described purposes, a protective film for circuit boards, which is arranged in contact with a circuit of a printed wiring board, contains a polyoxazolidone resin (A) that has a weight average molecular weight of 3 × 104 or more.
Inventors:
TAHARA SHUJI
YASUDA KIYOMI
YASUDA KIYOMI
Application Number:
PCT/JP2011/007277
Publication Date:
July 05, 2012
Filing Date:
December 26, 2011
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
TAHARA SHUJI
YASUDA KIYOMI
TAHARA SHUJI
YASUDA KIYOMI
International Classes:
C08L79/04; B32B15/08; B32B27/00; C08G73/06; C08L101/00; H05K3/28; H05K3/46
Foreign References:
| JP2006213793A | 2006-08-17 | |||
| JP2005054027A | 2005-03-03 | |||
| JP2006083289A | 2006-03-30 | |||
| JP2003522217A | 2003-07-22 | |||
| JPH0543657A | 1993-02-23 |
Attorney, Agent or Firm:
WASHIDA, KIMIHITO (JP)
Koichi Washida (JP)
Koichi Washida (JP)
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Claims: