Title:
RESIN COMPOSITION AND RESIST FILM
Document Type and Number:
WIPO Patent Application WO/2017/204206
Kind Code:
A1
Abstract:
To provide a resin composition having excellent heat resistance and dry etching resistance that can be used suitably as a resin material for a resist, a cured product thereof, a resin material for a resist made using the resin composition, and a resist film. A resin composition characterized by containing an epoxy resin (A) having a polyarylene ether structure (α) and a hydroxynaphthalene novolac phenol resin (B), a cured product of said composition, a resin material for a resist obtained using the resin composition, and a resist film.
Inventors:
IMADA TOMOYUKI (JP)
NAGAE NORIO (JP)
NAGAE NORIO (JP)
Application Number:
PCT/JP2017/019160
Publication Date:
November 30, 2017
Filing Date:
May 23, 2017
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G59/62; C08G8/08; C08L61/06; C08L63/00; G03F7/11
Foreign References:
| JP2014205774A | 2014-10-30 | |||
| JP2014218600A | 2014-11-20 | |||
| JP2015021086A | 2015-02-02 | |||
| JPH07258364A | 1995-10-09 |
Attorney, Agent or Firm:
KONO Michihiro (JP)
Download PDF:
Previous Patent: APPARATUS AND METHOD FOR PRODUCING FINE AIR BUBBLE MIXED LIQUID
Next Patent: TRANSMISSION BELT
Next Patent: TRANSMISSION BELT