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Patent Searching and Data


Title:
RESIN COMPOSITION FOR RESISTS AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/026666
Kind Code:
A1
Abstract:
The present invention provides a resin composition for resists that is for obtaining a resist which has the characteristics conventionally required of a resist and which also does not generate warping. This resin composition for resists includes a (meth)acrylic photocurable polymer, a thermosetting agent, and a photopolymerization initiator. The (meth)acrylic photocurable polymer includes a carboxyl group, an open-chain aliphatic hydrocarbon group having 12 or more carbon atoms, and an unsaturated double bond, and the glass transition temperature (Tg) of the (meth)acrylic photocurable polymer is 20°C or less.

Inventors:
GONDAIRA Takashi (5-5, Minami-honcho 1-chome, Joetsu-sh, Niigata 10, 〒9438610, JP)
ISHIDA Akira (5-5, Minami-honcho 1-chome, Joetsu-sh, Niigata 10, 〒9438610, JP)
Application Number:
JP2019/025900
Publication Date:
February 06, 2020
Filing Date:
June 28, 2019
Export Citation:
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Assignee:
ARISAWA MFG. CO., LTD. (5-5 Minami-honcho 1-chome, Joetsu-shi Niigata, 10, 〒9438610, JP)
International Classes:
G03F7/038; C08F299/00; G03F7/004; H01L23/14; H05K3/28
Domestic Patent References:
WO2014024804A12014-02-13
Foreign References:
JP2011043806A2011-03-03
JP2013024930A2013-02-04
JP2018159022A2018-10-11
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (Toranomon East Bldg. 10F, 7-13 Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
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