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Patent Searching and Data


Title:
RESIN COMPOSITION FOR SEALANT, MULTILAYER FILM FOR SEALANT, HEAT-FUSIBLE LAYERED FILM, AND PACKAGE
Document Type and Number:
WIPO Patent Application WO/2019/172375
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a resin composition for a sealant, in which bag manufacturing performance and inflation film manufacturing workability (extrusion characteristics and bubble stability) are obtained at the same time; a heat-fusible film and a sealant film in which the composition is used; and a package in which the heat-fusible film is used. This ethylene-based resin composition for a sealant satisfies conditions (1) through (3) simultaneously: (1) the melt index (I21: 190°C, 21.6 kg load) thereof is 42-80 g/10 minutes; (2) the ratio I21/I2 of the melt index (I21: 190°C, 21.6 kg load) and the melt index (I2: 190°C, 2.16 kg load) thereof is 5 to 25; and (3) the melt tension (190°C) thereof is 25 to 180 mN.

Inventors:
SEKIYA Keiko (3, Chigusakaigan, Ichihara-sh, Chiba 08, 〒2990108, JP)
SUZUKI Masao (3, Chigusakaigan, Ichihara-sh, Chiba 08, 〒2990108, JP)
SAITO Tetsuya (3, Chigusakaigan, Ichihara-sh, Chiba 08, 〒2990108, JP)
KUDO Yuta (3, Chigusakaigan, Ichihara-sh, Chiba 08, 〒2990108, JP)
Application Number:
JP2019/009106
Publication Date:
September 12, 2019
Filing Date:
March 07, 2019
Export Citation:
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Assignee:
PRIME POLYMER CO., LTD. (5-2 Higashi-Shimbashi 1-chome, Minato-ku Tokyo, 22, 〒1057122, JP)
International Classes:
C08L23/04; B32B27/32; C09K3/10
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (Gotanda Yamazaki Bldg. 6F, 13-6 Nishigotanda 7-chome, Shinagawa-k, Tokyo 31, 〒1410031, JP)
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