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Patent Searching and Data


Title:
RESIN COMPOSITION FOR SEALANTS, LAMINATED FILM, AND PACKAGING BAG
Document Type and Number:
WIPO Patent Application WO/2013/105524
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a resin composition for sealants, a laminated film and a packaging bag, whereby it becomes possible to improve non-adsorbability to organic components contained in contents and heat-sealing properties. Provided is a resin composition for sealants, comprising a cycloolefin polymer (COP) and a cycloolefin copolymer (COC), wherein the compounding ratio of the cycloolefin polymer (COP) is 10 to 95 wt% and the compounding ratio of the cycloolefin copolymer (COC) is 5 to 90 wt%.

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Inventors:
OKAMOTO HAJIME (JP)
KASHIMA KOUSUKE (JP)
INADA MASAKAZU (JP)
YOSHIDA MIHOKO (JP)
Application Number:
PCT/JP2013/050019
Publication Date:
July 18, 2013
Filing Date:
January 07, 2013
Export Citation:
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Assignee:
FUJIMORI KOGYO CO (JP)
International Classes:
B32B27/00; C09K3/10; B65D65/40; C08L45/00; C08L65/00
Foreign References:
JP2010077391A2010-04-08
JP2011148226A2011-08-04
JP2003019773A2003-01-21
JP2008519105A2008-06-05
JP2008517079A2008-05-22
JP2010031252A2010-02-12
JP2007291364A2007-11-08
JP2010031253A2010-02-12
Other References:
See also references of EP 2803713A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
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Claims: