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Title:
RESIN COMPOSITION FOR SEALANTS, MULTILAYER BODY, PACKAGING MATERIAL AND PACKAGING CONTAINER
Document Type and Number:
WIPO Patent Application WO/2020/196673
Kind Code:
A1
Abstract:
A resin composition for sealants, which contains (A) an ethylene/polar monomer copolymer, (B) a tackifying resin and (C) a 4-methyl-1-pentene/α-olefin copolymer, and which is configured such that the content of the 4-methyl-1-pentene/α-olefin copolymer (C) is from 1% by mass to 20% by mass relative to the total mass of the resin composition for sealants.

Inventors:
ISHIHARA TAKUYA (JP)
YAMAMOTO KOICHIRO (JP)
HASHIMOTO HIDENORI (JP)
Application Number:
PCT/JP2020/013467
Publication Date:
October 01, 2020
Filing Date:
March 25, 2020
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Assignee:
DOW MITSUI POLYCHEMICALS CO LTD (JP)
International Classes:
B32B27/32; B65D65/40; C08L23/08; C08L23/20; C08L53/02; C09K3/10
Foreign References:
JP2009227790A2009-10-08
JP2001131307A2001-05-15
JP2016148003A2016-08-18
JP2017110112A2017-06-22
JP2006315385A2006-11-24
JP2018076398A2018-05-17
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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