Title:
RESIN COMPOSITION FOR SEALING ELECTRICAL ELECTRONIC COMPONENTS, METHOD OF PRODUCING ELECTRICAL ELECTRONIC COMPONENT, AND SEALED ELECTRICAL ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2012/115065
Kind Code:
A1
Abstract:
Provided is a resin composition for sealing electrical electronic components which is not susceptible to gelation even when stagnant under high-temperature conditions, exhibits a superior initial bond strength to an aluminum material, and exhibits superior durability under environmental loads such as a cooling cycle load. Also provided is a sealed electrical electronic component using the resin composition. The resin composition for sealing electrical electronic components includes a crystalline polyester-based elastomer (A), a phenol-modified xylene resin (B1) and/or a phenolic resin (B2), and a polyolefin resin (C), and exhibits a melt viscosity of 5-3000 dPa·s when dried until the water content is 0.1% or less, heated to a temperature of 220°C, subjected to a pressure of 1 MPa and extruded by means of a die having a pore size of 1.0 mm and a thickness of 10 mm.
Inventors:
FUNAOKA DAIKI (JP)
SHIGA KENJI (JP)
SHIGA KENJI (JP)
Application Number:
PCT/JP2012/054031
Publication Date:
August 30, 2012
Filing Date:
February 21, 2012
Export Citation:
Assignee:
TOYO BOSEKI (JP)
FUNAOKA DAIKI (JP)
SHIGA KENJI (JP)
FUNAOKA DAIKI (JP)
SHIGA KENJI (JP)
International Classes:
C09K3/10; C08L23/00; C08L61/06; C08L61/18; C08L67/00; H01L23/29; H01L23/31
Foreign References:
| JP2010150471A | 2010-07-08 | |||
| JPH05175371A | 1993-07-13 | |||
| JPH01236268A | 1989-09-21 | |||
| JP2000178420A | 2000-06-27 | |||
| JPS6018562A | 1985-01-30 | |||
| JP3553559B2 | 2004-08-11 | |||
| JP2004083918A | 2004-03-18 | |||
| JP2010150471A | 2010-07-08 | |||
| JP4389144B2 | 2009-12-24 |
Other References:
See also references of EP 2679651A4
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Claims: