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Title:
RESIN COMPOSITION FOR SEALING ELECTRICAL OR ELECTRONIC COMPONENT, PROCESS FOR PRODUCING SEALED ELECTRICAL OR ELECTRONIC COMPONENT, AND SEALED ELECTRICAL OR ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2014/167940
Kind Code:
A1
Abstract:
Provided are: a sealed electrical or electronic component which exhibits excellent flame retardance and excellent adhesion; a process suitable for producing said sealed electrical or electronic component; and a resin composition for sealing an electrical or electronic component. A resin composition for sealing an electrical or electronic component, comprising: a polyester (A) that contains a polyalkylene glycol component as a segment bonded thereto; an alkylbenzene resin (B1) and/or a phenol resin (B2); an at least binary copolyolefin resin (C); and a phosphoric acid ester (D).

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Inventors:
WATANABE YOSUKE (JP)
SHIGA KENJI (JP)
Application Number:
PCT/JP2014/056897
Publication Date:
October 16, 2014
Filing Date:
March 14, 2014
Export Citation:
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Assignee:
TOYO BOSEKI (JP)
International Classes:
C08L67/02; C08K5/521; C08L23/00; C08L61/10; C08L61/22; H01L23/29; H01L23/31
Domestic Patent References:
WO2012115065A12012-08-30
WO2008026487A12008-03-06
Foreign References:
JP2002060596A2002-02-26
JPH08325449A1996-12-10
JPS61183351A1986-08-16
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