Title:
RESIN COMPOSITION FOR SEALING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/129417
Kind Code:
A1
Abstract:
Provided are: a resin composition for sealing an electronic device, the resin composition capable of adequately suppressing penetration by water vapor; and an electronic device in which the resin composition for sealing an electronic device is applied. The present invention includes (A) a polybutadiene polymer represented by chemical formula (1) having a (meth)acryloyl group at a terminal end thereof, and (B) a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or greater. (In chemical formula (1), R1 and R2 each represent a hydroxyl group or H2C=C(R7)-COO-, R3 and R4 each independently represent a C1-C16 substituted or unsubstituted divalent organic group, R5, R6, and R7 each represent a hydrogen atom or a C1-C10 alkyl group, and at least one organic group represented by chemical formula (2) is included within chemical formula (1). In chemical formula (1), l and m each represent 0 or 1, n is an integer of 15-150, and x:y = 0-100:100-0. R1 and R2 are never both a hydroxyl group.)
Inventors:
ASANUMA TAKUMI (JP)
AOYAMA MASAMI (JP)
ISHIZAKA YASUSHI (JP)
MIEDA TETSUYA (JP)
AOYAMA MASAMI (JP)
ISHIZAKA YASUSHI (JP)
MIEDA TETSUYA (JP)
Application Number:
PCT/JP2015/053122
Publication Date:
September 03, 2015
Filing Date:
February 04, 2015
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C09K3/10; C08F2/44; C08F2/50; C08F290/04; C08F299/00; C09D7/63; H01L21/312; H01L21/336; H01L23/29; H01L23/31; H01L29/786; H01L31/048; H01L51/50; H05B33/04
Foreign References:
| JP2010180258A | 2010-08-19 | |||
| JPH0733837A | 1995-02-03 | |||
| JPS6481813A | 1989-03-28 | |||
| JPS5993715A | 1984-05-30 |
Attorney, Agent or Firm:
MATSUSHITA, Makoto et al. (JP)
Matsushita 亮 (JP)
Matsushita 亮 (JP)
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