RESIN COMPOSITION FOR SEALING FILLER, FLIP CHIP MOUNTING METHOD USING SAME, AND FLIP CHIP MOUNTED ARTICLE

WIPO Patent Application WO/2007/032406

A1

Disclosed is a resin composition for sealing fillers which does not induce electrode corrosion in a wired circuit board during continuous voltage application test under high temperature, high humidity conditions, while having low elastic modulus and good stability at room temperature (25˚C). Also disclosed are a mounting method and a flip chip mounted article respectively using such a resin composition for sealing fillers. Specifically disclosed is a resin composition (6, 6A) for sealing fillers which is used as a sealing filler for bonding and sealing a space between a semiconductor chip (10) and a film-like base (1). This resin composition contains a polyolefin thermoplastic resin and an adhesiveness-imparting agent, and the chlorine ion concentration in the resin composition is more than 0 but not more than 10 ppm. The space between the semiconductor chip (10) and the film-like base (1) is filled with the resin composition (6, 6A), and a bump (11) of the semiconductor chip (10) and a metal plating (3) of the film-like base (1) are joined with each other.

MATSUZAKA OSAMU (JP)
YASU KATSUHIKO (JP)
HIRATA TOMOHIRO (JP)
OOKUBO TAKENORI (JP)

PCT/JP2006/318192

March 22, 2007

September 13, 2006

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HITACHI CHEMICAL CO LTD (JP)
MATSUZAKA OSAMU (JP)
YASU KATSUHIKO (JP)
HIRATA TOMOHIRO (JP)
OOKUBO TAKENORI (JP)

C08L23/00; C08L91/00; H01L23/29; H01L23/31

JP2000297200A	2000-10-24
JP2003277580A	2003-10-02
JP2001192438A	2001-07-17
JP2003128881A	2003-05-08
JPH0952941A	1997-02-25

SAKAI, Hiroaki (Kasumigaseki Building 2-5, Kasumigaseki 3-chom, Chiyoda-ku Tokyo, JP)

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