Title:
RESIN COMPOSITION FOR SEALING LIGHT-EMITTING ELEMENT, LIGHT SOURCE DEVICE, AND PRODUCTION METHOD FOR LIGHT SOURCE DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/020565
Kind Code:
A1
Abstract:
The present invention provides a resin composition for producing a sealing member having excellent heat resistance and sealing properties. The resin composition for sealing a light-emitting element according to the present invention satisfies at least a feature (i) that the composition has a polymer (P1) containing a constituent unit (A) represented by formula (1) and a constituent unit (B) having at least one functional group selected from the group consisting of carbonyl-containing groups, a hydroxyl group, an epoxy group, an isocyanate group, and a cyano group, or a feature (ii) that the composition has a polymer (P2) containing the constituent unit (A) and a polymer (P3) containing the constituent unit (B).
Inventors:
SUGIMOTO NAOYA (JP)
KAWAMITSU SHOICHI (JP)
KAWAMITSU SHOICHI (JP)
Application Number:
PCT/JP2020/029453
Publication Date:
February 04, 2021
Filing Date:
July 31, 2020
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L33/56; C08F222/04; C08L37/00; H01L23/28
Domestic Patent References:
| WO2016010043A1 | 2016-01-21 | |||
| WO2014178288A1 | 2014-11-06 | |||
| WO2005085303A1 | 2005-09-15 |
Foreign References:
| JP2013087162A | 2013-05-13 | |||
| JP2014080479A | 2014-05-08 |
Attorney, Agent or Firm:
KAMADA Koichi et al. (JP)
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