Title:
RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR, AND OPTICAL SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/035542
Kind Code:
A1
Abstract:
Provided is a resin composition for sealing optical semiconductors that enables the obtainment of a hardened product having excellent transparency, heat resistance, light resistance, and crack resistance, and that exhibits excellent conductivity characteristics and cold resistance/thermal shock properties in optical semiconductor devices when said hardened product is used as a sealing material. This resin composition for sealing optical semiconductors comprises an alicyclic epoxy compound having a specific structure, an alicyclic polyester resin having a specific structure, a specific hardener, and a specific hardening accelerator.
Inventors:
KIMURA NORIKO (JP)
Application Number:
PCT/JP2012/071295
Publication Date:
March 14, 2013
Filing Date:
August 23, 2012
Export Citation:
Assignee:
DAICEL CORP (JP)
KIMURA NORIKO (JP)
KIMURA NORIKO (JP)
International Classes:
C08L63/00; C08G59/24; C08L67/00; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
| WO2012093591A1 | 2012-07-12 |
Foreign References:
| JP2007314740A | 2007-12-06 | |||
| JPH06128359A | 1994-05-10 | |||
| JP2004131553A | 2004-04-30 | |||
| JP2002226674A | 2002-08-14 |
Attorney, Agent or Firm:
GOTO, YUKIHISA (JP)
Yukihisa Goto (JP)
Yukihisa Goto (JP)
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Claims:
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