Title:
RESIN COMPOSITION FOR SEALING AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/195883
Kind Code:
A1
Abstract:
This resin composition for sealing comprises: at least one compound selected from the group consisting of 3-amino-1,2,4-triazole and 4-amino-1,2,4-triazole as component (A); and an epoxy resin as component (B).
Inventors:
ITO MASAHARU (JP)
Application Number:
PCT/JP2020/010754
Publication Date:
October 01, 2020
Filing Date:
March 12, 2020
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08G59/20; C08K3/013; C08K5/3472; C08K5/54; C08L63/00
Domestic Patent References:
| WO2012117759A1 | 2012-09-07 |
Foreign References:
| JP2005281582A | 2005-10-13 | |||
| JP2006335829A | 2006-12-14 | |||
| JP2006199944A | 2006-08-03 | |||
| JP2006342419A | 2006-12-21 | |||
| JPH10189857A | 1998-07-21 | |||
| JPS61287155A | 1986-12-17 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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