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Patent Searching and Data


Title:
RESIN COMPOSITION, SEALING SHEET, AND SEALING BODY
Document Type and Number:
WIPO Patent Application WO/2019/189616
Kind Code:
A1
Abstract:
The present invention is a resin composition which comprises a modified polyolefin resin as a component (A), a compound having a cyclic ether group as a component (B), and a photocationic polymerization initiator as a component (C), wherein the content of the component (B) is over 50 parts by mass and less than or equal to 200 parts by mass with respect to 100 parts by mass of the component (A). The present invention is capable of providing: a resin composition which has excellent sheet processability (film formation property) in a normal temperature environment; a sealing sheet that has an adhesive layer which is formed using the resin composition, has a high storage modulus after an optical curing process, and has excellent adhesive strength and sealing performance; and a sealing body in which an object to be sealed is sealed using the sealing sheet.

Inventors:
NISHIJIMA KENTA (JP)
MAETANI SHIHO (JP)
KASHIO MIKIHIRO (JP)
Application Number:
JP2019/013692
Publication Date:
October 03, 2019
Filing Date:
March 28, 2019
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
C08L23/26; C08K5/1515; C08K5/54; C08L63/00; C09J7/30; C09J123/26; C09J163/00; H01L23/29; H01L23/31
Domestic Patent References:
WO2018047868A12018-03-15
Foreign References:
CN102161793A2011-08-24
CN102153802A2011-08-17
JPH11140414A1999-05-25
JP2008056848A2008-03-13
JP2003238885A2003-08-27
Attorney, Agent or Firm:
OHISHI Haruhito (JP)
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