Title:
RESIN COMPOSITION FOR SEALING, SEALING SHEET, AND ORGANIC EL ELEMENT SEALED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/261682
Kind Code:
A1
Abstract:
Provided is a resin composition for sealing, which is capable of producing a sealing sheet (sealing material) that exhibits a good balance between low moisture permeability, adhesiveness to an adherend, and adhesion reliability under a high temperature and a high humidity. One embodiment of this invention is a resin composition for sealing. This resin composition for sealing contains a modified polyolefin resin and an organic metal compound. The amount of the organic metal compound added to this resin composition for sealing is 0.1 to 10 parts by mass per 100 parts by mass of the modified polyolefin resin.
Inventors:
UNO EIJI (JP)
GENG ZHILIANG (JP)
HOSOYA TETSUYA (JP)
GENG ZHILIANG (JP)
HOSOYA TETSUYA (JP)
Application Number:
PCT/JP2020/013302
Publication Date:
December 30, 2020
Filing Date:
March 25, 2020
Export Citation:
Assignee:
SOKEN KAGAKU KK (JP)
International Classes:
C08K5/07; C08K3/08; C08L23/26; C08L57/00; C09K3/10; G09F9/30; H01L27/32; H01L51/50; H05B33/04
Domestic Patent References:
| WO2018092800A1 | 2018-05-24 |
Foreign References:
| JP2017101145A | 2017-06-08 |
Attorney, Agent or Firm:
TRY INTERNATIONAL IP LAW FIRM (JP)
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