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Patent Searching and Data


Title:
RESIN COMPOSITION, SEALING SHEET, AND SEALED BODY
Document Type and Number:
WIPO Patent Application WO/2019/189617
Kind Code:
A1
Abstract:
The present invention is a resin composition containing a component (A), a component (B), and a component (C), the component (A) being a modified polyolefin-based resin, the component (B) being a compound having a cyclic ether group, and the component (C) being a photo-cationic polymerization initiator. The present invention provides: a resin composition having excellent sheet processability (film forming properties); a sealing sheet having an adhesive layer which is formed with use of the resin composition and which has excellent adhesion strength, colorless transparency, and water-vapor blocking properties; and a sealed body obtained by sealing an object to be sealed, with use of the sealing sheet.

Inventors:
MAETANI Shiho (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
NISHIJIMA Kenta (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
KASHIO Mikihiro (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
Application Number:
JP2019/013693
Publication Date:
October 03, 2019
Filing Date:
March 28, 2019
Export Citation:
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Assignee:
LINTEC CORPORATION (23-23, Honcho Itabashi-k, Tokyo 01, 〒1730001, JP)
International Classes:
C08L23/26; C08K5/1515; C08K5/54; C08L63/00; C09J7/30; C09J123/26; C09J163/00; H01L23/29; H01L23/31
Domestic Patent References:
WO2018047868A12018-03-15
Foreign References:
CN102161793A2011-08-24
CN102153802A2011-08-17
JP2003238885A2003-08-27
JPH11140414A1999-05-25
JP2008056848A2008-03-13
Attorney, Agent or Firm:
OHISHI Haruhito (Kotani Bldg. 1F, 5-3 Uchikanda 2-chome, Chiyoda-k, Tokyo 47, 〒1010047, JP)
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