Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION FOR SEALING SHEET, SEALING SHEET AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/017053
Kind Code:
A1
Abstract:
Provided is a resin composition for a sealing sheet, the resin composition containing: (A) a crystalline epoxy resin and/or a liquid epoxy resin; (B) a phenolic resin curing agent; (C) a curing accelerator; (D) an inorganic filler; and (E) a ketimine group-containing silane compound.

Inventors:
SUDO, Nobuhiro (6 Takeda Tobadono-cho, Fushimi-ku, Kyoto-sh, Kyoto 01, 〒6128501, JP)
Application Number:
JP2018/018459
Publication Date:
January 24, 2019
Filing Date:
May 14, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KYOCERA CORPORATION (6 Takeda Tobadono-cho, Fushimi-ku Kyoto-sh, Kyoto 01, 〒6128501, JP)
International Classes:
C08G59/62; C08K3/36; C08K5/5465; C08L61/06; C08L63/00; C09K3/10; H01L23/29; H01L23/31
Foreign References:
JP2002155130A2002-05-28
JP2012062448A2012-03-29
JP2013036029A2013-02-21
JP2009114325A2009-05-28
JP2008248099A2008-10-16
JP2008255178A2008-10-23
Attorney, Agent or Firm:
HIRASAWA, Kenichi et al. (OHTANI PATENT OFFICE, Toranomon ES Bldg. 7F. 25-2, Toranomon 3-chome, Minato-k, Tokyo 01, 〒1050001, JP)
Download PDF: