Title:
RESIN COMPOSITION FOR SEALING
Document Type and Number:
WIPO Patent Application WO/2019/146617
Kind Code:
A1
Abstract:
The problem addressed by the present invention is to provide a resin composition for sealing capable of suppressing warpage even when sealing a large-area substrate. To solve this problem, a resin composition for sealing electronic components that contains (A) an epoxy resin, (B) a compound having a polyalkylene glycol chain, and (C) an inorganic filler is provided. The effect of being able to suppress warpage even when sealing a large-area substrate is obtained thereby.
Inventors:
OI YOSUKE (JP)
HIRAOKA TAKASHI (JP)
HIRAOKA TAKASHI (JP)
Application Number:
PCT/JP2019/002010
Publication Date:
August 01, 2019
Filing Date:
January 23, 2019
Export Citation:
Assignee:
NAGASE CHEMTEX CORP (JP)
International Classes:
C08L63/00; C08G59/22; C08K3/36; H01L23/29; H01L23/31
Domestic Patent References:
| WO2018221682A1 | 2018-12-06 |
Foreign References:
| JPS62210653A | 1987-09-16 | |||
| JPS6189247A | 1986-05-07 | |||
| JP2006176678A | 2006-07-06 | |||
| JP2012162585A | 2012-08-30 | |||
| JP2007314702A | 2007-12-06 | |||
| JPH11199651A | 1999-07-27 | |||
| JP2004018786A | 2004-01-22 | |||
| JP2002076203A | 2002-03-15 |
Attorney, Agent or Firm:
TOKKYO GYOMUHOJIN YUKON (JP)
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