Title:
RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/022070
Kind Code:
A1
Abstract:
Provided is a resin composition for semiconductor encapsulation that can give an encapsulating material in a semiconductor device, in which the encapsulating material, even when having a reduced thickness, retains the insulating properties and has the improved property of hiding the interior structure of the semiconductor device. The resin composition for semiconductor encapsulation comprises a thermosetting resin (A), a filler (B), and a colorant (C). The filler (B) has an average particle diameter of 0.5-15.0 μm. The colorant (C) has an electrical resistivity of 1.0 Ω·m or greater.
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Inventors:
SADA HIKARU
ARAYAMA CHIKA
ARAYAMA CHIKA
Application Number:
PCT/JP2019/027393
Publication Date:
January 30, 2020
Filing Date:
July 10, 2019
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08L101/00; C08K3/013; C08K3/22; H01L21/56; H01L23/29; H01L23/31
Domestic Patent References:
WO2012169506A1 | 2012-12-13 | |||
WO2012124737A1 | 2012-09-20 | |||
WO2007058261A1 | 2007-05-24 | |||
WO2006095914A1 | 2006-09-14 | |||
WO2019078024A1 | 2019-04-25 |
Foreign References:
JP2014152302A | 2014-08-25 | |||
JP2007161990A | 2007-06-28 | |||
JP2007329007A | 2007-12-20 | |||
JP2000345000A | 2000-12-12 | |||
JP2015106674A | 2015-06-08 | |||
JP2008208222A | 2008-09-11 | |||
JP2007063401A | 2007-03-15 | |||
JP2006278959A | 2006-10-12 | |||
JP2002348439A | 2002-12-04 | |||
JP2001335677A | 2001-12-04 | |||
JP2018168262A | 2018-11-01 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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