Title:
RESIN COMPOSITION AND SEMICONDUCTOR MOUNTING SUBSTRATE OBTAINED BY MOLDING SAME
Document Type and Number:
WIPO Patent Application WO/2013/111697
Kind Code:
A1
Abstract:
A resin composition which contains at least constituent elements (A)-(E) described below and wherein the epoxy resin (A) contains 80-100% by mass of a bifunctional epoxy resin and component (D) is contained in an amount of 60-85% by mass relative to 100% by mass of the total mass of the resin composition. This resin composition does not substantially contain a solvent and is in a liquid state at room temperature.
(A) an epoxy rein
(B) an amine-based curing agent
(C) an accelerator that has at least one functional group selected from among a dimethylureide group, an imidazole group and a tertiary amino group
(D) silica particles
(E) a silane coupling agent
Provided is a resin composition which has excellent curability at low temperatures and a sufficiently low linear expansion coefficient after curing. This resin composition does not suffer from warping in cases where applied to a copper thin film and molded, and does not suffer from separation or cracks even if a substrate obtained therefrom is bent. Also provided is a semiconductor mounting substrate which is obtained by molding the resin composition.
Inventors:
OKA HIDEKI (JP)
TOMIOKA NOBUYUKI (JP)
HONDA SHIRO (JP)
TOMIOKA NOBUYUKI (JP)
HONDA SHIRO (JP)
Application Number:
PCT/JP2013/051068
Publication Date:
August 01, 2013
Filing Date:
January 21, 2013
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08G59/56; C08L63/00; C08K3/36; C08K5/49; C08K5/5415; H01L23/14; H05K1/03
Foreign References:
| JP2001214041A | 2001-08-07 | |||
| JP2011246596A | 2011-12-08 | |||
| JP2003218249A | 2003-07-31 | |||
| JP2006143784A | 2006-06-08 | |||
| JP2003292734A | 2003-10-15 | |||
| JP2001270976A | 2001-10-02 |
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Claims: