Title:
RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, COPPER-FOIL-ATTACHED RESIN, AND CIRCUIT BOARD COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2022/119389
Kind Code:
A1
Abstract:
A resin composition for a semiconductor package, according to an embodiment, is a resin composition which is a composite of a resin and a filler arranged in the resin, wherein the filler content in the resin composition ranges between 68 to 76 wt%, the filler comprises a first filler group consisting of fillers having a first diameter, a second filler group consisting of fillers having a second diameter smaller than the first diameter, and a third filler group consisting of fillers having a third diameter smaller than the second diameter, and the amounts of the first filler group, the second filler group, and the third filler group in the filler are different from each other.
More Like This:
| JPH0718097 | [Title of Invention] Colorant |
| WO/2005/118714 | ABRASION RESISTANT FLUOROPOLYMER COMPOSITIONS CONTAINING MICROPULP |
| JP2006335909 | MEMBER FOR ELECTRONIC EQUIPMENT |
Inventors:
KIM YONG SUK (KR)
KIM JEONG HAN (KR)
KIM JEONG HAN (KR)
Application Number:
PCT/KR2021/018247
Publication Date:
June 09, 2022
Filing Date:
December 03, 2021
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
C08K7/02; B32B15/08; B32B15/20; C08J5/04; C08J5/24; C08K5/01; C08L63/00; C08L101/00; H05K1/03
Foreign References:
| KR20160024917A | 2016-03-07 | |||
| JP4890804B2 | 2012-03-07 | |||
| KR101786217B1 | 2017-10-17 | |||
| KR20110001186A | 2011-01-06 | |||
| KR20100096910A | 2010-09-02 |
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
Download PDF: