RESIN COMPOSITION FOR SEMICONDUCTOR SEALING USE, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING RESIN COMPOSITION FOR SEMICONDUCTOR SEALING USE

WIPO Patent Application WO/2019/155950

A1

A resin composition for semiconductor sealing use according to the present invention which contains an epoxy resin, a curing agent, an inorganic filler and carbon black microparticles. When the resin composition for semiconductor sealing use is transfer-molded into a specimen having a length of 80 mm, a width of 10 mm and a thickness of 4 mm under the conditions including a mold temperature of 175°C, a transfer pressure of 10 MPa and a curing time of 120 seconds, then the specimen is heated at 175°C for 4 hours to produce a cured article, and then the surface of the cured article is observed with a SEM, the maximum diameter of aggregates of the carbon black microparticles is 50 μm or less.

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JPH09235358	PHOTOCURABLE EPOXY RESIN COMPOSITION FOR ELECTRONIC PART AND PRODUCTION OF ELECTRONIC PART WITH THE SAME
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KOTANI TAKAHIRO (JP)
SHIBATA HIROSHI (JP)

PCT/JP2019/003081

August 15, 2019

January 30, 2019

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SUMITOMO BAKELITE CO (JP)

H01L23/29; C08K3/013; C08K3/04; C08L63/00; H01L23/31

WO2013136685A1

2013-09-19

JP2000007894A	2000-01-11
JP2005120277A	2005-05-12
JP2017179129A	2017-10-05
JP2006278959A	2006-10-12
JP2007067164A	2007-03-15
JP2005119197A	2005-05-12
JP2013001861A	2013-01-07
JP2009275110A	2009-11-26
JP2018018871A	2018-02-01
JP2018018872A	2018-02-01

See also references of EP 3751601A4

HAYAMI Shinji (JP)

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