RESIN COMPOSITION, RESIN SHEET, CURED FILM, METHOD FOR MANUFACTURING CURED FILM, SEMICONDUCTOR DEVICE, ORGANIC EL DISPLAY DEVICE, AND DISPLAY DEVICE

WIPO Patent Application WO/2021/085321

A1

Provided is a resin composition that can impart resistance to strippers for removing photoresist used during wiring formation and resistance to a temperature and humidity controlled test (HAST), and that excels in a pattern shape of the cured film after heat treatment when having the photosensitivity.　The resin composition includes (A) one or more resins selected from the group consisting of a polyimide, a polybenzoxazole, a polyimide precursor, a polybenzoxazole precursor, and copolymers thereof, (B) a phenol resin, and (C) a thermal crosslinking agent, wherein the phenol resin (B) has a structural unit represented by a specific general formula (4), the structural unit represented by a general formula (4) has structural units represented by a specific general formula (5) and a specific general formula (6), and where the number of all structural units represented by the general formula (4) in the phenol resin (B) is 100, the ratio of the number of structural units represented by the general formula (5) and the general formula (6) is the general formula (5) : the general formula (6) = 60 : 40 to 90 : 10.

HASHIMOTO KEIKA (JP)
MASUDA YUKI (JP)
TOMIKAWA MASAO (JP)

PCT/JP2020/039856

May 06, 2021

October 23, 2020

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TORAY INDUSTRIES (JP)

C08K5/13; C08K5/42; C08L61/04; C08L79/08; G03F7/004; G03F7/023; G09F9/30; H01L51/50; H05B33/02; H05B33/22

WO2014069091A1	2014-05-08
WO2018066395A1	2018-04-12
WO2017188153A1	2017-11-02

JP2010197748A	2010-09-09
JP2014227464A	2014-12-08
JPH08286370A	1996-11-01
JP2014211517A	2014-11-13

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