RESIN COMPOSITION SHEET, AND METHOD FOR PRODUCTION THEREOF

WIPO Patent Application WO/2011/114692

A1

Disclosed is a resin composition sheet which enables the molding temperature to be lowered from the range of 260-280°C to the range of 200-250°C when using the resin composition sheet to manufacture product packaging such as a carrier tape, and which is less susceptible to visible defects from the transferral of the shape of a release film, even when heated to a relatively high temperature via the release film by means of a contact heater. Specifically disclosed is a resin composition sheet that includes a polycarbonate resin, an amorphous polyester resin, and a silicate compound filler. Such a resin composition sheet is suited for use in the manufacture of product packaging such as carrier tapes. When the resin composition sheet is used as product packaging for packaging objects that are vulnerable to static electricity, it is preferable to add a conductive filler to the resin composition sheet in order to prevent electrostatic buildup in the packaged product.

NAKANIWA TETSUYA (JP)
FUJIMOTO TAKAHIRO (JP)
WATANABE MASAHIKO (JP)

PCT/JP2011/001476

September 22, 2011

March 14, 2011

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SUMITOMO BAKELITE CO (JP)
NAKANIWA TETSUYA (JP)
FUJIMOTO TAKAHIRO (JP)
WATANABE MASAHIKO (JP)

C08L67/02; C08J5/18; C08K3/34; C08L69/00

JP2002001891A	2002-01-08
JP2000044779A	2000-02-15
JP2001347614A	2001-12-18
JP2002121365A	2002-04-23
JP2000226507A	2000-08-15
JP2004255782A	2004-09-16
JP2003118057A	2003-04-23
JP2003118059A	2003-04-23
JP2003119354A	2003-04-23
JP2005054179A	2005-03-03
JP2004091691A	2004-03-25
JP2000313058A	2000-11-14

CREIA IP ATTORNEYS (JP)
Patent business corporation クレイア patent firm (JP)

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