Title:
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/003314
Kind Code:
A1
Abstract:
Provided is a resin composition that, when used in a multilayer printed circuit board, exhibits superior heat resistance and coating, and exhibits superior plating adhesion and developability. Also provided are a resin sheet with a support body, and a multilayer printed circuit board and a semiconductor device that use said resin composition and said resin sheet with a support body. The resin composition includes a biphenyl aralkyl-type epoxy resin (A) expressed by formula (1), a photocuring initiator (B), a compound (C) expressed by formula (2), and a compound (D) that has an ethylenically unsaturated group other than the (C) component.
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Inventors:
KITAMURA SHINYA (JP)
SUZUKI TAKUYA (JP)
SHIKA SEIJI (JP)
SUZUKI TAKUYA (JP)
SHIKA SEIJI (JP)
Application Number:
PCT/JP2017/018045
Publication Date:
January 04, 2018
Filing Date:
May 12, 2017
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G59/32; H05K1/03
Domestic Patent References:
| WO2016088744A1 | 2016-06-09 | |||
| WO2013115069A1 | 2013-08-08 | |||
| WO2014196501A1 | 2014-12-11 | |||
| WO2013008684A1 | 2013-01-17 | |||
| WO2011126070A1 | 2011-10-13 |
Foreign References:
| JP2011256271A | 2011-12-22 | |||
| JP2009132780A | 2009-06-18 | |||
| JP2013079326A | 2013-05-02 | |||
| JP2007211143A | 2007-08-23 | |||
| JP2003082067A | 2003-03-19 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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