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Title:
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/262579
Kind Code:
A1
Abstract:
The resin composition according to the present invention comprises: a bismaleimide compound (A) which contains a structural unit represented by formula (1) and a maleimide group at both ends of a molecular chain; at least one resin or compound (B) selected from the group consisting of maleimide compounds other than the bismaleimide compound (A), cynate ester compounds, benzoxazine compounds, epoxy resins, carbodiimide compunds, and compounds containing an ethylenically unsaturated group; and a photocuring initiator (C). (In formula (1), R1 represents a C1-C16 straight chain or branched alkylene group, or a C2-C16 straight chain or branched alkenylene group. R2 represents a C1-C16 straight chain or branched alkylene group, or a C2-C16 straight chain or branched alkenylene group. Each R3 independently represents a hydrogen atom, a C1-C16 straight chain or branched alkylene group, or a C2-C16 straight chain or branched alkenylene group. Each n independently represents an integer from 1-10.)

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Inventors:
KUMAZAWA YUNE (JP)
SUZUKI TAKUYA (JP)
SHIKA SEIJI (JP)
KATAGIRI SHUNSUKE (JP)
Application Number:
PCT/JP2020/025141
Publication Date:
December 30, 2020
Filing Date:
June 26, 2020
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
H05K1/03; C08F222/40
Domestic Patent References:
WO2018056466A12018-03-29
WO2019013194A12019-01-17
WO2018056466A12018-03-29
Foreign References:
JP2019511587A2019-04-25
JP2016169337A2016-09-23
JP2006022173A2006-01-26
JP2020033472A2020-03-05
JP2005062450A2005-03-10
JP2010204298A2010-09-16
JPH0912712A1997-01-14
JP2019122268A2019-07-25
Other References:
See also references of EP 3919531A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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